MX3000™ 3D AOI
MX3000™ Powered by CyberOptics’ revolutionary 3D sensing technology — consisting of two MRS® sensors — provides synchronized, double-sided automated final visual inspection of a single memory module, delivering metrology-grade accuracy at production speed.
Precision Grade
Normal Grade N
High Grade H
Precision Grade P
Super Precision SP
Ultra Precision UP
| Inspection Speed | 50 cm²/sec (2D+3D) |
| Board Length Board Width | Min 25 mm / Max 140 mm Min 17 mm / Max 35 mm |
| Component Types Under Inspection | Standard SMT (chips, J-leads, gull-wing leads, BGA, etc.), through-hole, odd-form, clips, connectors, pin headers, etc. |
| 3D Measurement / Inspection | Lifted leads, package coplanarity, polarity dents and chamfer recognition |
| Dispensed flow | Less than 10 um |
| Max Product Height | 35 mm |
| Solder-Joint Defect Categories | Bridging, opens, lifted leads, wetting, excess/insufficient solder, debris, etc. |
| Other Inspection Types | Gold-finger contamination, via pins, bent leads, debris, OCR/OCV, etc. |