Semiconductor AOI Inspection Platforms

Metrology-Grade Accuracy at Production Speed

The SE3000 DD SPI system uses the revolutionary MRS® technology, delivering unmatched accuracy by precisely identifying and suppressing reflections caused by shiny components and reflective solder joints. Critically, MRS effectively suppresses multiple reflections, making it an ideal technology solution for a wide range of applications, including those with the most demanding quality requirements.

The resolution of CyberOptics' proprietary Multi-Reflection Suppression (MRS) sensor has been refined to an even finer level. The ultra-high-resolution MRS sensor enhances the SE3000 DD platform and delivers superior inspection performance, ideally suited to 0201 Metric processes and microelectronics applications where higher accuracy and inspection reliability are critical.

Highly Flexible

SE3000 DD 3D Solder Paste Inspection (SPI) (SPI) system extends the award-winning SE3000™ 3D SPI platform. The dual-lane, dual-sensor system maximizes flexibility to meet different PCB width requirements. This unique design can inspect large-volume components, conveniently inspecting different component and board sizes on separate lanes simultaneously, and even switching from dual-lane to single-lane mode to inspect very large boards.

SE3000 DD provides PCB flexibility as well as the flexibility to choose two identical or two different proprietary MRS sensors.

Fast, smart, easy-to-use software

SPI V5 series software delivers a best-in-class user experience through an intuitive interface, transforming how users interact with our systems. The SPI V5 series software provides a range of innovative features for smarter, faster inspection through a full multi-touch experience.